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Semiautomatic Wire Bond Pull Tester - Micropull IV
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Semiautomatic Wire Bond Pull Tester - Micropull IV
Features:
For Destructive and Nondestructive Testing
Conforms to MIL-STD-883C Methods 2011 & 2023, MIL-STD-1772
As Fast as One Test per Second with Programmed Printout
0.5 to 1000 Gram-Force Range with Interchangeable Beams
Available with Fixed and Rotatable Hook Beams
Semiautomatic Operation Increases Throughput
Holders for Most Devices
MP4
The Unitek MICROPULL IV (MP4) is a semiautomatic machine designed to perform wire bond pull tests in the 0.5 to l000 gram-force range, using three interchangeable beams, at rates of up to one test per second.

MP4 Datasheet: Click here to download the Adobe Acrobat Reader
 


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Miyachi Unitek Corporation
1820 S. Myrtle Ave., Monrovia, CA 91016 USA
626-303-5676 (ph) 626-358-8048 (fx)
24/7 Repair Service 1-866-751-7378